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Adpt-A16




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Overview

The Adpt-A-series probe adapter enables seamless integration between acute-style neural probes and the X3 X-Headstage™. Designed for versatility, these adapters support 16-, 32-, and 64-channel probes, ensuring broad compatibility with a wide range of neural probes available on the market.







Adpt-A16 Overview

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Adpt-A16




Connector

Headstage

  • Molex PN: 505070-3422

Probe

  • IC Socket DIP-18P(2x9) 2.54mm/7.62mm

  • Compatible Neuronexus probes: A16, D16, MRA16




Dimension

V1 & V 1.1

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V2

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unit: mm







Versions

V1: Identified by K22022 on PCB

Original design

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V1.1: Identified by 100011A on PCB

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V2: Identified by 100011B on PCB

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Ground & Reference Configuration

A16 V1 & V1.1 Adapter (SKU: Adpt-A16v1 & V1.1)

  • Ground (G) and reference (R) signals are independent by default.
  • To short them together at the adapter, solder a short wire between the G and R pads.


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Adpt-A16




A16 V2 Adapter (SKU: Adpt-A16v2)

Proper grounding and referencing are essential for high-quality signal acquisition. Always ensure that both ground and reference signals are securely connected. If either is left floating, significant noise may be introduced into the recordings.

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  • ER: Solder pad for external reference (wire), this solder pad is connected fo signal R.

  • EG: Solder pad for external ground (wire), this solder pad is connected fo signal G.

  • ES: Solder pad for external shielding (wire), this solder pad is connected fo signal S.

  • By default, the headstage ground (G) and reference (R) are independent.
    - To connect reference and ground at the adapter, short JP1.
    - Ground (G) is sourced from the probe ground (PG). To use an external ground (EG) via the adapter, cut JP2 and solder a wire to the EG pad.
    - Reference (R) is sourced from the probe reference (PR). To use an external reference (ER) via the adapter, cut JP3 and solder a wire to the ER pad.
    - Shielding (S) is connected by default to ground (G). To use an external shielding signal (ES) via the adapter, cut JP4 and solder a wire to the ES pad.
    - The adapter’s metal rod is electrically isolated from the headstage. To connect it to the adapter’s shielding, short JP5.




    Configuring the Jumper Pad

    ① To connect the jumper, apply solder around JP1 until a solid solder bead forms.

    V2-14

    ② To disconnect, use a soldering iron and desoldering mesh to remove the solder bridging the jumper pad.

    If the jumper pas has a default short configuration, use a scalpel or precision blade to cleanly sever the trace.

    V2-15
    ③ After modification, clean the area thoroughly using isopropyl alcohol or flux remover to eliminate any residual material.
    ④ Always verify connectivity using a multimeter to ensure proper configuration.







    Pin Map

    V1: Identified by K22022 on PCB

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    V1.1: Identified by 100011A on PCB

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    V2: Identified by 100011B on PCB

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