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Adpt-A64-SR




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Overview

The Adpt-A64-SR is a signal remapping adapter designed for use with X3SR64 headstages. It enables compatibility with 64-channel probe adapters and accessories that do not use the SR (Split-Reference) configuration by internally remapping channel and reference assignments to the SR architecture.
This adapter provides a compact, inline interface that preserves signal integrity while expanding probe and accessory compatibility within XSR-mode acquisition workflows.







Adpt-A64-SR Overview

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Adpt-A64-SR




Connector

Headstage

  • Molex PN: 505070-3422

Probe

  • Samtec PN: FOLC-110-01-S-Q
  • Compatible Neuronexus probes: A64, MRA64, OA64LP, OA64LP V2







Dimension

V1: Identified by 100282 on PCB

Original design

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V2: Identified by 100282C on PCB

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unit: mm







Versions

V1: Identified by 100282 on PCB

Original design

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V2: Identified by 100282C on PCB

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Ground & Reference Configuration

A64 SR V1 Adapter (SKU: Adpt-A64-SRv1)

  • Ground (G) and reference (R) signals are independent by default.
  • To short them together at the adapter, solder a short wire between the G and R pads.


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Adpt-A64-SR




A64 V2 Adapter (SKU: Adpt-A64-SRv2)

Proper grounding and referencing are essential for high-quality signal acquisition. Always ensure that both ground and reference signals are securely connected. If either is left floating, significant noise may be introduced into the recordings.

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  • ER: Solder pad for external reference (wire), this solder pad is connected fo signal R.

  • EG: Solder pad for external ground (wire), this solder pad is connected fo signal G.

  • ES: Solder pad for external shielding (wire), this solder pad is connected fo signal S.

  • By default, the headstage ground (G) and reference (R) are independent.
    - To connect reference and ground at the adapter, short JP1.
    - Ground (G) is sourced from the probe ground (PG). To use an external ground (EG) via the adapter, cut JP2 and solder a wire to the EG pad.
    - Reference (R) is sourced from the probe reference (PR). To use an external reference (ER) via the adapter, cut JP3 and solder a wire to the ER pad.
    - Shielding (S) is connected by default to ground (G). To use an external shielding signal (ES) via the adapter, cut JP4 and solder a wire to the ES pad.
    - The adapter’s metal rod is electrically isolated from the headstage. To connect it to the adapter’s shielding, short JP5.




    Configuring the Jumper Pad

    ① To connect the jumper, apply solder around JP1 until a solid solder bead forms.

    V2-14

    ② To disconnect, use a soldering iron and desoldering mesh to remove the solder bridging the jumper pad.

    If the jumper pas has a default short configuration, use a scalpel or precision blade to cleanly sever the trace.

    V2-15
    ③ After modification, clean the area thoroughly using isopropyl alcohol or flux remover to eliminate any residual material.
    ④ Always verify connectivity using a multimeter to ensure proper configuration.







    Pin Map

    V1: Identified by 100282 on PCB

    Original design

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    V2: Identified by 100282C on PCB

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